l - band 90 w 2 - stage fully matched gan module surface mount laminate package rev. v2 mamg - 001214 - 090psm 1 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macomtech.com for additional data sheets and product information. for further information and support please visit: https://www.macomtech.com/content/customersupport features ? compact size (14x24 mm 2 ) ? gan on sic d - mode transistor technology ? fully matched, de - coupled dc and rf ? typical bias: 45 v, class ab ? intended for pulsed radar applications ? output power > 90 w, with 30 db gain and 60% power added efficiency ? up to 3 ms pulse width and 10% duty cycle ? mttf = 600 years (t j < 200c) ? thermally enhanced laminate lga package ? rohs* compliant. lead free reflow compatible ? msl - 3 description the mamg - 001214 - 090psm is a 2 - stage gan power module in a true smt laminate package. the module is fully matched. under pulsed conditions, it can deliver output power greater than 90 w, with 30 db typical associated gain and 60% typical power added efficiency. flexible design allows for gate and/or drain pulsing. additional features include a gate voltage sense port for use in temperature compensation or pulse droop compensation. the overall package size is very small, only 14x24 mm 2 . the modules compact size, combined with excellent rf performance makes this product an ideal solution for pulsed radar applications where low cost, light weight and small size are the key. ordering information 1 functional schematic pin configuration pin no. function 1 rf in 2 vg 3 3 vd1 4 nc 4 5 vg sense 5 6 ground 7 vd2 8 rf out 9 nc 4 part number package mamg - 001214 - 090psm bulk packaging mamg - 0t1214 - 090psm 100 piece reel mamg - l21214 - 090psm evaluation board 2 3. one common gate voltage for both stages in the module. 4. do not connect. 5. do not connect to ground if not used. 1. reference application note m513 for reel size information. 2. includes one module surface - mounted onto board. * restrictions on hazardous substances, european union directive 2002/95/ec.
l - band 90 w 2 - stage fully matched gan module surface mount laminate package rev. v2 mamg - 001214 - 090psm 2 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macomtech.com for additional data sheets and product information. for further information and support please visit: https://www.macomtech.com/content/customersupport electrical specifications 6 parameter symbol min. typ. max. units rf functional tests: freq. = 1200 - 1400 mhz, v dd = 45 v, i dq = 300 ma, t a = 25c, z l = 50 , pulse width = 1 ms, duty cycle = 10%, p in = 19 dbm peak output power 7 p out 49.1 49.8 - dbm 82 99 - w power gain g p 30.1 30.9 - db power added efficiency pae 56 60 - % pulse droop 8 droop - 0.3 0.4 db 2 nd harmonic 2f0 - - 40 - dbc 3 rd harmonic 3f0 - - 52 - dbc load mismatch stability vswr - s - 5:1 - - load mismatch tolerance vswr - t - 6:1 - - 6. typical rf performance measured in rf evaluation board (see layout on page 4). 7. peak output power measured at center of pulse. 8. pulse droop measured between 10% and 90% of pulse. parameter absolute maximum input power 26 dbm drain supply voltage (pulsed), v dd +55 v gate supply voltage range, v gg - 9 v to - 2.5 v supply current, i dd 4.0 a power dissipation, pulsed mode @ 85oc 80 w junction temperature 14 200 c operating temperature - 40c to +85c storage temperature - 65c to +150c esd maximum - human body model (hbm) 600 v esd maximum - charged device model (cdm) 300 v absolute maximum ratings 9,10,11,12,13 9. exceeding any one or combination of these limits may cause permanent damage to this device. 10. macom does not recommend sustained operation near these survivability limits. 11. for saturated performance it is recommended that the sum of (3 * v dd + abs (v gg )) < 175 v. 12. cw operation is not recommended. 13. operating at nominal conditions with t j 200c will ensure mttf > 1 x 10 6 hours. junction temperature directly affects device mttf and should be kept as low as possible to maximize lifetime. 14. junction temperature (t j ) = t c + ? jc * ((v * i) - (p out - p in )). typical transient thermal resistance ? jc = 1.7 c/w (3 ms pulses, 10% duty cycle)
l - band 90 w 2 - stage fully matched gan module surface mount laminate package rev. v2 mamg - 001214 - 090psm 3 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macomtech.com for additional data sheets and product information. for further information and support please visit: https://www.macomtech.com/content/customersupport parts list parts are measured and sampled in the evaluation board shown on the left. the board is made of 8 - mil thick ro4003c and is bolted onto a ni - plated aluminum plate. electrical and thermal ground is provided using a cu - filled via - hole array (pictured below). very few external components are used, as dc blocks are not required. evaluation board outline part case style value c1 radial 100 ? f c2 0603 10 nf turning the device on 1. set v g to the pinch - off value (v p ), typically - 6 v. 2. turn on v d to nominal voltage (50 v). 3. increase v g to desired quiescent current. 4. apply rf power to desired level. turning the device off 1. turn off rf power. 2. decrease v g down to v p. 3. turn off v d . 4. turn off v g . bias sequencing evaluation board via - hole array & landing pattern 15,16,17 15. all dimensions are in inches. 16. landing pattern indicates solder mask opening. cu - filled via - holes under the ground are used for optimal thermal performance. recommended pattern: 8 - mil diameter, 8 - mil spacing. 17. layout drawing available upon request.
l - band 90 w 2 - stage fully matched gan module surface mount laminate package rev. v2 mamg - 001214 - 090psm 4 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macomtech.com for additional data sheets and product information. for further information and support please visit: https://www.macomtech.com/content/customersupport handling procedures please observe the following precautions to avoid damage: static sensitivity gallium nitride devices and circuits are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices. package outline 18,19 18. all dimensions are in inches. 19. reference application note s2083 for lead - free solder reflow recommendations. plating is ni/pd/au.
l - band 90 w 2 - stage fully matched gan module surface mount laminate package rev. v2 mamg - 001214 - 090psm 5 5 5 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macomtech.com for additional data sheets and product information. for further information and support please visit: https://www.macomtech.com/content/customersupport applications section output power vs. input power typical large - signal performance curves: freq. = 1.3 ghz, 1 ms pulses, 10% duty cycle, v dd = 45 v, i dq = 300 ma, t a = 25c 2f0 and 3f0 harmonics vs. input power power added efficiency vs. input power 46 47 48 49 50 51 12 14 16 18 20 22 output power (dbm) input power (dbm) 40 45 50 55 60 65 12 14 16 18 20 22 pae (%) input power (dbm) - 60 - 55 - 50 - 45 - 40 12 14 16 18 20 22 harmonics (dbc) input power (dbm) 2f0 3f0
l - band 90 w 2 - stage fully matched gan module surface mount laminate package rev. v2 mamg - 001214 - 090psm 6 6 6 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macomtech.com for additional data sheets and product information. for further information and support please visit: https://www.macomtech.com/content/customersupport applications section output power vs. frequency pulse droop vs. frequency typical large - signal performance curves over frequency: 1 ms pulses, 10% duty cycle, v dd = 45 v, i dq = 300 ma, t a = 25c power added efficiency vs. frequency 0.0 0.1 0.2 0.3 0.4 0.5 1.20 1.25 1.30 1.35 1.40 pulse droop (db) frequency (ghz) 300 us, 10% duty 3 ms, 10% duty 49.8 49.9 50.0 50.1 50.2 50.3 50.4 1.20 1.25 1.30 1.35 1.40 pout (dbm) frequency (ghz) 61 62 63 64 65 66 1.20 1.25 1.30 1.35 1.40 pae (%) frequency (ghz)
l - band 90 w 2 - stage fully matched gan module surface mount laminate package rev. v2 mamg - 001214 - 090psm 7 7 7 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macomtech.com for additional data sheets and product information. for further information and support please visit: https://www.macomtech.com/content/customersupport applications section output power vs. frequency pulse droop vs. frequency typical large - signal performance curves over temperature: 1 ms pulses, 10% duty cycle, v dd = 45 v, i dq = 300 ma pae vs. frequency 75 80 85 90 95 100 105 110 1.20 1.25 1.30 1.35 1.40 output power (w) frequency (ghz) - 40 c 0 c +25 c +50 c +85 c 54 56 58 60 62 64 66 1.20 1.25 1.30 1.35 1.40 pae (%) frequency (ghz) - 40 c +25 c +85 c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 1.20 1.25 1.30 1.35 1.40 pulse droop (db) frequency (ghz) - 40 c 0 c +25 c +50 c +85 c
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